Process range conditions of copper plating series


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Process range conditions of copper plating series

  • Categories:Industry News
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  • Time of issue:2015-06-22 16:59
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Process range conditions of copper plating series

  1. Process conditions of acidic bright copper plating:

  Copper sulfate 160-240g/L

  Sulfuric acid 40-90g/L

  Chloride ion 30-120mg/L

  210MU cylinder opening agent 2-5mu/L

  210A leveling agent 0.3-0.6ml/L

  210B brightener supplement

  Anode: Phosphor bronze corner (ball)

  Temperature 18-38 ℃

  Cathode current density 1.5-8 A/d㎡

  Anode current density 0.5-3A/d㎡

  Voltage 2-4V

  2. Cyanide-free alkaline copper plating process range conditions:

  Copper sulfate 35-45g/L

  Potassium carbonate 35-45g/L

  Complexing agent 160-260ml/L

  Additive 20-30ml/L

  Brightener 8-12ml/L

  Temperature 30-50 ℃

  3. Pyrophosphate bright copper plating process range conditions:

  Copper pyrophosphate 75-95g/L

  Potassium pyrophosphate 280-350g/L

  Ammonia 1-3ml/L

  Brightener 0.4-1ml/L


  Anode: Electrolytic copper plate (corner)

  Temperature 55-60℃

  Cathode current density 1-6A/d㎡

  Anode current density 1-3.5A/d㎡

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