1. Process conditions of acidic bright copper plating:

　　Copper sulfate 160-240g/L

　　Sulfuric acid 40-90g/L

　　Chloride ion 30-120mg/L

　　210MU cylinder opening agent 2-5mu/L

　　210A leveling agent 0.3-0.6ml/L

　　210B brightener supplement

　　Anode: Phosphor bronze corner (ball)

　　Temperature 18-38 ℃

　　Cathode current density 1.5-8 A/d㎡

　　Anode current density 0.5-3A/d㎡

　　Voltage 2-4V

　　2. Cyanide-free alkaline copper plating process range conditions:

　　Copper sulfate 35-45g/L

　　Potassium carbonate 35-45g/L

　　Complexing agent 160-260ml/L

　　Additive 20-30ml/L

　　Brightener 8-12ml/L

　　Temperature 30-50 ℃

　　3. Pyrophosphate bright copper plating process range conditions:

　　Copper pyrophosphate 75-95g/L

　　Potassium pyrophosphate 280-350g/L

　　Ammonia 1-3ml/L

　　Brightener 0.4-1ml/L

　　PH:8.5-8.9

　　Anode: Electrolytic copper plate (corner)

　　Temperature 55-60℃

　　Cathode current density 1-6A/d㎡

　　Anode current density 1-3.5A/d㎡